Measuring the Thermal Resistance in Light Emitting Diodes Using a Transient Thermal Analysis Technique-Reference-Cited by-同舟云学术

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Measuring the Thermal Resistance in Light Emitting Diodes Using a Transient Thermal Analysis Technique

Published:2013-08 Issue:8 Volume:60 Page:2548-2555
ISSN:0018-9383
Container-title:IEEE Transactions on Electron Devices
language:
Short-container-title:IEEE Trans. Electron Devices

Author:

Natarajan Shweta,Ha Minseok,Graham Samuel

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/16/6564406/06558789.pdf?arnumber=6558789

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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3. The Relationship between Packaging Structures, Chip Area and Thermal Resistance of NMOS Semiconductor in Transient Dual Interface Method;Proceedings of the 2021 5th International Conference on Electronic Information Technology and Computer Engineering;2021-10-22

4. Understanding multi-domain compact modeling of light-emitting diodes;Cogent Engineering;2021-01-01

5. Multi-Variable Thermal Modeling of Power Devices Considering Mutual Coupling;Applied Sciences;2019-08-08

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