Abstract
Technology called MEMS (Micro Electro Mechanical Systems) or microsystems are heterogeneous integration on silicon chips and play important roles as sensors. MEMS as switches and resonators fabricated on LSI are needed for future multi-band wireless systems. MEMS for safety systems as event driven tactile sensor network for nursing robot are developed. Wafer level packaging for MEMS and open collaboration to reduce the cost for the development are discussed.
Publisher
Trans Tech Publications Ltd
Reference18 articles.
1. K. Hirano, S. Tanaka and M. Esashi, Aluminum Nitride Lamb Wave Resonator Using Germanium Sacrificial Layer, Proc. of the 25th Sensor Symposium, (2008) pp.195-198.
2. K. Matsuo, M. Moriyama, M. Esashi and S. Tanaka, Low-voltage PZT-actuated MEMS Switch Mobolithically Integrated with CMOS Circuit, Tech. Digest IEEE MEMS 2012, (2012). pp.1153-1156.
3. T. Matsumura, M. Esashi, H. Harada and S. Tanaka, Multi-band Radio-frequency Filter Fabricated Using Polyimide-based Membrane Transfer Bonding Technology, J. of Micromech. Microeng., 20, (2010). 095027(9pp).
4. K.D. Park, M. Esashi and S. Tanaka, Wafer-level Heterointegration Process for SAW Devices on LSI, 2010 IEEE Ultrasonics Symposium, (2010) pp.100-101.
5. H. Yanagida, S. Yoshida, M. Esashi and S. Tanaka, Simple Removal Technology Using Ozone Solution for Chemically-stable Polymer Used for MEMS, Tech. Digest IEEE MEMS 2011, (2011) pp.324-327.
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Integrating MEMS and ICs;Microsystems & Nanoengineering;2015-05-28