Affiliation:
1. NASA Glenn Research Center
Abstract
The prospects for beneficial application of integrated circuit (IC) capabilities in ambient environments above 450 °C have been significantly improved by recent long-term demonstrations of SiC chips and packaging by NASA Glenn Research Center. This invited paper reviews and updates development of durable SiC IC technology aspects relevant to engineering infusion into beneficial applications, including the first long-duration low-mass Venus lander missions
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
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