Abstract
Sn-Pb solder alloys, widely used in electronic industry, will be restricted because of the toxicity of Pb. That is paramount importance that developing viable alternative lead-free solders for electronic assemblies. Sn-Ag-Cu alloys are better alternative because of its good performance. But they have a melting temperature of 217-225°C that is much higher than that of Sn-Pb eutectic alloy, 183°C. It may be very difficulty to realize industrialization. Sn-Ag-Cu-Ga solder alloys have been studied in this paper, including a series of properties tests, such as melting point, hardness, shear
strength and solderability. The best composition of Sn-Ag-Cu-Ga lead-free solder alloy has been obtained.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
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