Growth Kinetics of Intermetallic Compounds During Interfacial Reactions Between SnAgCuGa Lead-Free Solder and Cu Substrate

Author:

Chen HuiMing,Shang Genfeng,Hu Wang Yi,Wang Hang

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics,Ceramics and Composites

Reference16 articles.

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Interface behavior and performance of Sn–Ag–Cu lead-free solder bearing Tb;Journal of Materials Science: Materials in Electronics;2022-08-20

2. LOW-MELTING NON-TOXIC ALLOYS AS MATRICES OF COMPOSITE COMPOUNDS FOR PERMANENT CONNECTION OF HETEROGENEOUS MATERIALS;Physical and chemical aspects of the study of clusters, nanostructures and nanomaterials;2019-12-16

3. Two-Side Growth of the Cu9Ga4 Phase during the Interfacial Reactions between Sn–Ag–Cu–Ga Solders and Copper Substrates;Physics of Metals and Metallography;2019-05

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