Affiliation:
1. ACM Research Inc.
2. Shanghai Huali Microelectronics Corporation
Abstract
Batch SPM systems do not meet the current clean specification/requirements below 28nm. Single wafer SPM systems use a high volume of chemistry which runs to drain, while meeting the cleaning specifications below 28nm. The work in this paper describe the use of a batch SPM system and a single wafer clean in an integrated system, Ultra-C Tahoe which results in meeting the technical specification and using less that 80% of the SPM chemistry used in single wafer systems. The data collected shows this new system meet the specifications, whilst saving more than 80%of SPM chemistry.
Publisher
Trans Tech Publications, Ltd.
Subject
Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics
Reference6 articles.
1. Photomask and Next-Generation Lithography Mask Technology XVI, edited by Kunihiro Hosono Proc. of SPIE Vol. 7379(2009).
2. David H. Wang et al.: Removal of Fine Particle using SAPS Technology and Functional Water UCPSS (2012). Proc of Solid State Phenomens 1012-0394 V.195.
3. Butterbaugh J.W, Christenson K,K, Lee N.P., A high temperature batch spray process for implanted resist stripping" Solid Stae Technology Vol.49,pp.83-85, 2006].
4. David H. Wang, Yue Ma, Fuping Chen, Liangzhi Xie, Xi Wang, and Xiaoyan Zhang, Juyoung Lee, Dongjoo Kim, Jeongyun Lee, Pyo Leem, Geunmin Choi, Removal of Fine Particle using SAPS Technology and Functional Water,, SEMICON Korea 2013 Conference, February 8, 2012, Seoul, Korea.
5. Kubrobe.H. & Morita.H; Environmentally concious design and inverse manufacturing. Dec 590-591(2005).
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