Removal of Fine Particle Using SAPS Technology and Functional Water-Reference-Cited by-同舟云学术

Removal of Fine Particle Using SAPS Technology and Functional Water

Published:2012-12 Issue: Volume:195 Page:185-190
ISSN:1662-9779
Container-title:Solid State Phenomena
language:
Short-container-title:SSP

Author:

Wang David H.¹,Ma Yue¹,Chen Fu Ping¹,Xie Liang Zhi¹,Wang Xi¹,Zhang Xiao Yan¹,Lee Ju Young²,Kim Dong Joo²,Lee Jeong Yun²,Leem Pyo²,Choi Geun Min²

Affiliation:

1. ACM Research Inc.

2. SK Hynix Semiconductor Incorporation

Abstract

Space alternated phase shift (SAPS) megasonic technology incorporating with functional water, with dissolving gases H2 or N2, was applied to remove fine particle in wet cleaning processes of semiconductor manufacturing in this study. The performances of particle removal were investigated quantitatively by varying the parameters of functional water and megasonic energy. The optimized cleaning performance was further proved with significant yield improvement of mass production by comparison with other main cleaning technology.

Publisher

Trans Tech Publications, Ltd.

Subject

Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics

Link

https://www.scientific.net/SSP.195.185.pdf

Reference4 articles.

1. Hiroshi Kurobe and Hiroshi Morita, Environmentally conscius design and inverse manufacturing, Dec. 590-591(2005).

2. Masayuki Toda and Seijiu Uryuu, Cleaning technology in semiconductor device manufacturing VIII , Volume 26, 1-12(2003).

3. Hiroshi Morita and Tochihiro Ii, Cleaning technology in semiconductor device manufacturing VI, Volume 36, 45-48(1999).

4. Hiroshi Morita, Semiconductor Manufaturering, Dec. (2006).

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