Development of Cu Brazing Sheet with Cu-P Composite Plating

Abstract

A Cu brazing sheet has been developed using a Cu-P composite plating method. A Cu-P composite plating layer, which contains 7mass%P, was formed on a Cu plate with a copper sulfate solution including P particles. The melting start temperature of the Cu-P composite layer was determined to be approximately 765°C. Microstructure and joint strength of a brazed joint with the Cu-P composite layer were investigated and compared with those of the joint with a conventional Cu-7P filler foil. As the results of the study, it was clarified that the Cu-P composite layer developed is feasible to use as a brazing material for Cu and Cu alloys.