Design of Double-Sided Polishing Machine for Functional Crystal Substrate-Reference-Cited by-同舟云学术

Design of Double-Sided Polishing Machine for Functional Crystal Substrate

Published:2014-09 Issue: Volume:1017 Page:580-585
ISSN:1662-8985
Container-title:Advanced Materials Research
language:
Short-container-title:AMR

Author:

Yang Jin Shuang¹,Zhu Xiang Long¹,Dong Zhi Gang¹,Kang Ren Ke¹,Guo Dong Ming¹,Zhang Bi¹

Affiliation:

1. Dalian University of Technology

Abstract

Responding to the demand on the ultra-precision equipment for machining monocrystalline silicon, sapphire, zirconia ceramics and other large-size functional crystal substrates in the microelectronics and optoelectronics manufacturing, this study analyzes the current state-of-the-art of polishing technologies and the technical challenges to achieving high surface quality substrates. In this study, a planetary double-sided polishing machine is designed to solve the problem between achieving high polishing quality and efficiency. The machine is characterized by process stability, large polishing pressure and high polishing speed, etc. which is verified by polishing zirconia substrates with satisfactory results: material removal rate of 5 μm/h and the surface roughness Ra of 1 nm.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Link

https://www.scientific.net/AMR.1017.580.pdf

Reference6 articles.

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