Precision Fabrication of Thin Copper Substrate by Double-sided Lapping and Chemical Mechanical Polishing-Reference-Cited by-同舟云学术

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Precision Fabrication of Thin Copper Substrate by Double-sided Lapping and Chemical Mechanical Polishing

Published:2019-08 Issue: Volume:44 Page:47-54
ISSN:1526-6125
Container-title:Journal of Manufacturing Processes
language:en
Short-container-title:Journal of Manufacturing Processes

Author:

Pan Bo^ORCID,Kang Renke,Guo Jiang^ORCID,Fu Haiyang,Du Dongxing,Kong Jinxing

Funder

Science Challenge Project

LiaoNing Revitalization Talents Program

Science Fund for Creative Research Groups of NSFC

Central Universities

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management

Reference22 articles.

1. Fabrication of nanocrystalline copper by explosive loading and its dynamic mechanics properties;Wang;Combust Explos Shock Waves,2011

2. Low-temperature hermetic thermo-compression bonding using electroplated copper sealing frame planarized by fly-cutting for wafer-level MEMS packaging;Salman;Sens Actuator A-Phys,2018

3. Understanding the friction and wear of KDP crystals by nanoscratching;Yong;Wear,2015

4. Dynamic error budget analysis of an ultraprecision flycutting machine tool;Sun;Int J Adv Manuf Tech,2014

5. A novel machine tool design approach based on surface generation simulation and its implementation on a fly cutting machine tool;Chen;Int J Adv Manuf Tech,2015

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1. Enhanced precision lapping techniques for fused quartz optical elements: Synergistic integration of mechanical and mechanochemical processes;Ceramics International;2024-08

2. Novel green chemical mechanical polishing by controlling pH values and redox reaction for achieving atomic surface of a nickel alloy;Applied Surface Science;2024-06

3. Molecular Dynamics Analysis of Adhesive Forces between Silicon Wafer and Substrate in Microarray Adhesion;Lubricants;2024-05-21

4. The Development of the Stress-Free Polishing System Based on the Positioning Error Analysis for the Deterministic Polishing of Jet Electrochemical Machining;Micromachines;2024-03-14

5. Kinematics and trajectory analysis of swinging fixed abrasive plane lapping: Effect of swinging mode on the lapping uniformity;Precision Engineering;2024-03

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