Effects of Different Package Structures on Thermal Properties of High Power White LED-Reference-Cited by-同舟云学术

Effects of Different Package Structures on Thermal Properties of High Power White LED

Published:2012-02 Issue: Volume:503 Page:397-401
ISSN:1662-9795
Container-title:Key Engineering Materials
language:
Short-container-title:KEM

Author:

Sun Zhe Ran¹,Wu Da Ming²,Zhang Ya Jun²,Zhuang Jian²,Dang Kai Fang²

Affiliation:

1. Beijing University of Chemical Technology

2. Beijing University of Chemical Technology

Abstract

The characteristics of several package structures of high power white Light emitting diode (LED) are described in this paper. The influence of different structures on thermal properties is analyzed. Forward voltage method is used to test the thermal resistance of LED chips.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://www.scientific.net/KEM.503.397.pdf

Reference7 articles.

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2. Adam Chrisensen and Samuel Graham, Thermal effects in packaging high power light emitting diode arrays, Applied Thermal Engineering. 29(2009): 364-371.

3. Tal, Henry Kwong-Hin and John E, W O. Patent 010235Al. (2011).

4. Michael R. Krames and Peter J. Schmidt, U. S Patent 0126017Al. (2007).

5. Bhat. Jerome Chandra and Steigerwaid. Daniel A, E P Patent 1256987A2. (2002).

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