Abstract
We calculated thehydrogen silsesquioxane (HSQ) resistprofiles with different contrast developers (γ from 1.9 to 8.1) to reveal the effect of resist contrast on pattern resolution performance. Based on our home-made development modeling, the suitable energy deposition distribution (EDD) regions for various developers were determined by evaluating the quality of simulated patterns. High contrast TMAH 2.3 wt%/NaCl 4 wt% developer was demonstrated that it is suitable to form very fine dot arrays with a size of 7 nm. Low contrast developer has the limitation of forming fine pattern with sufficient height. The simulation results indicated that increasing developer contrast is benefit to improve pattern resolution.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
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