Abstract
We have studied on theoretical electron energy deposition in thin resist layer on Si substrate for electron beam lithography. We made Monte Carlo simulation to calculate the energy distribution and to consider formation of nanometer sized pattern regarding electron energy, resist thickness and resist type. The energy distribution in 100 nm-thick resist on Si substrate were calculated for small pattern. The calculations show that 4 nm-wide pattern will be formed when resist thickness is less than 30 nm. Furthermore, a negative resist is more suitable than positive resist by the estimation of a shape of the energy distribution.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference7 articles.
1. C. Vieu, F. Carcenac, A. Pepin: Appl. Surf. Sci. Vol. 164 (2000), p.111.
2. W. Zhang, A. Potts, D.M. Bagnall, B.R. Davidson, Thin Solid Film, Vol. 515(2007), pp.3714-3717.
3. K. Murata, T. Matsukawa, Jpn.J. Appl. Phys., Vol. 10(1971), pp.678-685.
4. R. Shimizu, Z.J. Ding, Rep. Prog. Phys. 1992, pp.487-531.
5. L.M. Ren, B.Q. Chen Z.Y. Tan, IEEE, Vol. 10(2001), pp.928-930.
Cited by
9 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献