Studying Pressure Induced Whiskers Formation from Sn-Rich Surfaces

Abstract

Whiskers formed on the lead-free tin surfaces pose a serious risk to small electronic devices causing a short circuit and leading to the component/device failure. The present research was focused on the investigation of tin whisker formation on a motor control unit sockets made of tin coated copper, applying to the specimen mechanical load alone or together with heat treatment/electric current. Scanning Electron Microscopic (SEM) imaging was applied in order to study the microstructure of tin whiskers obtained, their length and number at the boundary of each imprint. If the mechanical stress increases from 1000 to 5000 MPa, the average number of whiskers and possible formation spots also increase from 570 to 1300. The length of whiskers varied from 3 μm after 0.5 h to 5.5 μm after 3 hours of exposition. It has been found that heat treatment at 150°C for 1 hour significantly reduces the number of whiskers (on average 6 times as few) formed. Therefore, the threat of failure of the electronic equipment is reduced.