Risk of whiskers formation on the surface of commercially available tin-rich alloys under thermal shocks-Reference-Cited by-同舟云学术

Risk of whiskers formation on the surface of commercially available tin-rich alloys under thermal shocks

Published:2009-06 Issue:6 Volume:49 Page:569-572
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Skwarek Agata,Witek Krzysztof,Ratajczak Jacek

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference12 articles.

1. Brusse JA, Gary JG, Siplon JP. Tin whiskers: attributes and mitigation. In: Proc. 22nd capacitor and resistor technology symp (CARTS); 2002. p. 67–80.

2. Choi WJ, Lee TY, Tu KN, Tamura N, Celestre RS, MacDowell AA, et al. Structure and kinetics of sn whisker growth on pb-free solder finish. In: Proc. IEEE elec. comp. technol. conf; 2002. p. 628–33.

3. Rapid growth of tin whiskers on the surface of Sn-6.6Lu alloy;Chuang;Scripta Mater,2007

4. Effect of Cu additives on Sn whisker formation of Sn(Cu) finishes;Kao;J Electr Mater,2006

5. Osterman M. Mitigation strategies for tin whiskers. CALCE website .

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