Development of an Extreme High Temperature n-Type Ohmic Contact to Silicon Carbide

Author:

Evans Laura J.1,Okojie Robert S.1,Lukco Dorothy2

Affiliation:

1. NASA Glenn Research Center (GRS)

2. ASRC Aerospace Corporation

Abstract

We report on the initial demonstration of a tungsten-nickel (75:25 at. %) ohmic contact to silicon carbide (SiC) that performed for up to fifteen hours of heat treatment in argon at 1000 °C. The transfer length method (TLM) test structure was used to evaluate the contacts. Samples showed consistent ohmic behavior with specific contact resistance values averaging 5 x 10-4 Ω-cm2. The development of this contact metallization should allow silicon carbide devices to operate more reliably at the present maximum operating temperature of 600 °C while potentially extending operations to 1000 °C.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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