Design, Yield and Process Capability Study of 8 kV 4H-SiC PIN Diodes

Author:

Bolotnikov Alex V.1,Losee Peter A.1,Matocha Kevin2,Nasadoski Jeff1,Glaser John1,Arthur Steve1,Stum Z.1,Garrett J.1,Elasser Ahmed1,Stevanovic Ljubisa1,Naik Harsh3,Chow T. Paul3

Affiliation:

1. General Electric Global Research Center

2. SemiSouth Laboratories, Inc

3. Rensselaer Polytechnic Institute

Abstract

This paper presents a study of performance and scalability of 8kV SiC PIN diodes focusing on area-dependent yield and sensitivity to material properties variation. Successfully fabricated 18 and 36 mm2 SiC-PiN diodes exhibited avalanche breakdown above 8 kV and < 5V forward voltage drop at 100 A/cm2 current density. The fast switching operation of these diodes up to ~5 kHz frequency is evidenced by reverse recovery measurements with by double-pulse inductive switching tests. The devices exhibit 0.142 and 0.169 uC/cm2 stored charge at room temperature and 125oC, respectively, when turned-off from Jf = 100A/cm2 to Vr = 2.1 kV. The measured diode breakdown voltage exhibited location and size dependent yield, indicating the necessity of material quality improvements for production.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference6 articles.

1. P. Losee, et al., IEEE Trans. Elect. Dev. 55, 1824-1829 (2008).

2. A. Elasser, et al., Mat. Sci. Forum 645, 1053-1056 (2010).

3. Z. Stum, et al., Mat. Sci. Forum 679, 637-640 (2010).

4. J. Glaser et al, IEEE Applied Power Electronics Conference Exposition, 1049 - 1056 (2011).

5. W. Kuo, et al., Yield, and Stress Burn-in, Boston, MA: Kluwer, (1998).

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