Design, Yield and Process Capability Study of 8 kV 4H-SiC PIN Diodes
Author:
Affiliation:
1. General Electric Global Research Center
2. SemiSouth Laboratories, Inc
3. Rensselaer Polytechnic Institute
Abstract
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.scientific.net/MSF.717-720.953.pdf
Reference6 articles.
1. P. Losee, et al., IEEE Trans. Elect. Dev. 55, 1824-1829 (2008).
2. A. Elasser, et al., Mat. Sci. Forum 645, 1053-1056 (2010).
3. Z. Stum, et al., Mat. Sci. Forum 679, 637-640 (2010).
4. J. Glaser et al, IEEE Applied Power Electronics Conference Exposition, 1049 - 1056 (2011).
5. W. Kuo, et al., Yield, and Stress Burn-in, Boston, MA: Kluwer, (1998).
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. High Voltage and Fast Switching Reverse Recovery Characteristics of 4H-SiC PiN Diode;Materials Science Forum;2014-02
2. Open circuit voltage decay characteristics of 4H-SiC p–i–n diode with carbon implantation;Japanese Journal of Applied Physics;2014-01-01
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