Reliability, Yield, and Stress Burn-In

Author:

Kuo Way,Chien Wei-Ting Kary,Kim Taeho

Publisher

Springer US

Cited by 39 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. E3C Techniques for Protecting NAND Flash Memories;Journal of Electronic Testing;2023-07-01

2. Risk Management Informed by an Uncertain Bathtub Curve (Invited);2023 IEEE International Reliability Physics Symposium (IRPS);2023-03

3. Determining the effect of burn-in process on reliability of X7R multilayer ceramic capacitors;Journal of Materials Science;2022-08-22

4. Scanning thermal microscopy for accurate nanoscale device thermography;Nano Today;2021-08

5. Flexible time reduction method for burn‐in of high‐quality products;Quality and Reliability Engineering International;2021-04-30

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