Flexible time reduction method for burn‐in of high‐quality products-Reference-Cited by-同舟云学术

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Flexible time reduction method for burn‐in of high‐quality products

Published:2021-04-30 Issue:6 Volume:37 Page:2900-2915
ISSN:0748-8017
Container-title:Quality and Reliability Engineering International
language:en
Short-container-title:Qual. Reliab. Engng. Int.

Author:

Kurz Daniel¹,Lewitschnig Horst²^ORCID,Pilz Juergen¹^ORCID

Affiliation:

1. Department of Statistics University of Klagenfurt Klagenfurt Austria

2. Infineon Technologies Austria AG Villach Austria

Publisher

Wiley

Subject

Management Science and Operations Research,Safety, Risk, Reliability and Quality

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/qre.2896

Reference28 articles.

1. Burn‐in;Block H;Stat Sci,1997

2. Reliability, Yield, and Stress Burn-In

3. CMOS IC Technology Scaling and Its Impact on Burn-In

4. Determining Optimum Burn-In and Replacement Times Using Bayesian Decision Theory

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Early Lifetime Estimation for Automotive LIDAR Using Realistic L4 Usage Profiles;Recent Advances in Microelectronics Reliability;2024

2. An Artificial Intelligence-Based Framework for Burn-in Reduction in the Semiconductor Manufacturing Industry;Recent Advances in Microelectronics Reliability;2024

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