Silicon Lifecycle Managements Addressing Reliability, Availability and Serviceability Requirements in HPC/Datacenter and Automotive Systems

Author:

FISH Randolph1,ATHAVALE Jyotika1

Affiliation:

1. Synopsys, Inc.

Publisher

Institute of Electronics, Information and Communications Engineers (IEICE)

Reference17 articles.

1. (1) 1856-2017-IEEE Standard Framework for Prognostics and Health Management of Electronic Systems, https://ieeexplore.ieee.org/document/8227036.

2. (2) J.L. Hafner, V. Deenadhayalan, W. Belluomini, and K. Rao, “Undetected disk errors in raid arrays,” IBM Journal of Research and Development, vol. 52, no. 4.5, pp. 413-425, 2008.

3. (3) R. Kashyap, “Silicon lifecycle management (SLM) with in-chip monitoring,” 2021 IEEE International Reliability Physics Symposium (IRPS), Monterey, CA, USA, pp. 1-4, 2021.

4. (4) F.W. Barrett, “MCM standard packaging for thermal performance,” Workshop on MCM and VLSI Packaging Techniques and Manufacturing Technologies, Windsor, UK, 1994.

5. (5) “Application of predictive maintenance to hardware with ISO 26262-5,” https://www.iso.org/standard/83605.html.

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