Abstract
Abstract
We report the hybrid integration of a telecom band InAs/InP quantum-dot (QD) single-photon source on a CMOS-processed Si photonics chip using transfer printing. The integration technique allows for the assembly of photonic components in a pick-and-place operation and therefore can introduce them on Si photonics chips after completing the entire CMOS-compatible fabrication processes. We demonstrate telecom single-photon generation from an InAs/InP QD integrated on Si and its coupling into a waveguide. We also demonstrate the integration of a QD on a fiber-pigtailed Si chip and single-photon output through the optical fiber, showing a novel pathway for modularizing solid-state quantum light sources.
Funder
KAKENHI
Precursory Research for Embryonic Science and Technology
JSPS KAKENHI Grant-in-Aid for Specially Promoted Research
DFG projects
New Energy and Industrial Technology Development Organization
Bundesministerium für Bildung und Forschung
Subject
General Physics and Astronomy,General Engineering
Cited by
3 articles.
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