Thermal mismatch induced stress characterization by dynamic resonance based on diamond MEMS

Abstract

Abstract We report on the precise measurement of the thermal mismatch induced stress by dynamic resonance method. The metallic electrodes are deposited on a single-crystal diamond microelectromechanical resonator for the Joule heating and stress generation. The results show that the resonance frequency is linearly dependent on the induced stress. The stress resolution in this work is as precise as 104 Pa, which is three orders of magnitude better than those obtained by Raman and X-ray diffraction methods.