Electrochemical Migration of Copper in Adsorbed Moisture Layers-Reference-Cited by-同舟云学术

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Electrochemical Migration of Copper in Adsorbed Moisture Layers

Published:1989-08 Issue:8 Volume:45 Page:643-648
ISSN:0010-9312
Container-title:CORROSION
language:en
Short-container-title:CORROSION

Author:

Zamanzadeh M.,Liu Y.-S.,Wynblatt P.,Warren G. W.

Publisher

NACE International

Subject

General Materials Science,General Chemical Engineering,General Chemistry

Link

http://corrosionjournal.org/doi/pdf/10.5006/1.3579318

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Failure Mechanisms Driven Reliability Models for Power Electronics: A Review;Journal of Electronic Packaging;2022-10-22

2. Impact of electric field at rough copper lines on failure time due to electrochemical migration in PCBs;Microelectronics Reliability;2021-02

3. Recent advances in method of suppressing dendrite formation of tin-based solder alloys;Journal of Materials Science: Materials in Electronics;2020-07-07

4. Lifetime Prediction of Electrochemical Ion Migration with Various Surface Finishes of Printed Circuit Boards;Journal of Electronic Materials;2019-09-05

5. Method for Mitigating Electrochemical Migration on Printed Circuit Boards;Journal of Electronic Materials;2019-05-29

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