Resist Poisoning Studies of Gap Fill Materials for Patterning Metal Trenches in Via-First Dual Damascene Process
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Reference20 articles.
1. Study of High Etch Rate Bottom Antireflective Coating and Gap Fill Materials Using Dextrin Derivatives in ArF Lithography
2. Gap Fill Materials Using Cyclodextrin Derivatives in ArF Lithography
3. Characterization of Gap Fill Materials for Planarizing Substrate in Via-First Dual Damascene Lithography Process
4. Study of Self Cross-Link Bottom Antireflective Coating and Gap Fill Materials for Sublimate Defect Reduction in ArF Lithography
5. Effect of solvents and cross-link reaction group concentration on via filling performance in gap fill materials
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