Porous Low-Dielectric-Constant Material for Semiconductor Microelectronics
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IntechOpen
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http://www.intechopen.com/download/pdf/64997
Reference108 articles.
1. The International Technology Roadmap for Semiconductor; ITRS 1997
2. Thompson SE, Parthasarathy S. Moore’s law: The future of Si microelectronics. Materials Today. 2006;9:20-25
3. Isaac RD. The future of CMOS technology. IBM Journal of Research and Development. 2000;44:369-378
4. Bohr M. MOS transistors: Scaling and performance trends. Semiconductor International. 1995;18(6):75-80
5. Dixit GA, Havemann RH. Overview of Interconnect—Copper and Low-k Integration, Handbook of Semiconductor Manufacturing Technology. 2nd ed. NY: CRC Press; 2008. (Chapter 2)
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