Review of methods for the mitigation of plasma‐induced damage to low‐dielectric‐constant interlayer dielectrics used for semiconductor logic device interconnects-Reference-Cited by-同舟云学术

Review of methods for the mitigation of plasma‐induced damage to low‐dielectric‐constant interlayer dielectrics used for semiconductor logic device interconnects

Published:2019-06-27 Issue:9 Volume:16 Page:1900039
ISSN:1612-8850
Container-title:Plasma Processes and Polymers
language:en
Short-container-title:Plasma Process Polym

Author:

Miyajima Hideshi¹²,Ishikawa Kenji²^ORCID,Sekine Makoto²,Hori Masaru²

Affiliation:

1. Advanced Memory Development CenterToshiba Memory Corporation, Yamanoisshiki‐cho Yokkaichi Japan

2. Graduate School of EngineeringNagoya University, Furo‐cho Chikusa Nagoya Japan

Publisher

Wiley

Subject

Polymers and Plastics,Condensed Matter Physics

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/ppap.201900039

Reference171 articles.

1. Wikipedia Skylake (microarchitecture) last accessed January 20 2019.

2. Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects—State of the art

3. Plasma processing of low-k dielectrics

4. PECVD low and ultralow dielectric constant materials: From invention and research to products

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