Spin Coating Film Transfer and Hot-Pressing System for Uniform Dielectric Formation and Its Application to Porous Low-kFilm Formation-Reference-Cited by-同舟云学术

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Spin Coating Film Transfer and Hot-Pressing System for Uniform Dielectric Formation and Its Application to Porous Low-kFilm Formation

Published:2008-01-18 Issue:1 Volume:47 Page:113-118
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Kawagoe Masafumi,Adachi Hideki,Yanagida Takaaki,Komura Tomoyuki,Saito Hidenori,Sato Norio,Kudou Kazuhisa,Machida Katsuyuki

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Reference9 articles.

1. Interconnect opportunities for gigascale integration

2. Novel global planarization technology for interlayer dielectrics using spin on glass film transfer and hot pressing

3. Advanced transfer system for spin coating film transfer and hot-pressing in planarization technology

4. Advanced Spin Coating Film Transfer and Hot-Pressing Process for Global Planarization with Dielectric-Material-Viscosity Control

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Design and preparation of porous polybenzoxazole films using the tert-butoxycarbonyl group as a pore generator and their application for patternable low-k materials;Polym. Chem.;2012

2. MEMS Process by Film Transfer Using a Fluorocarbon Anti-Adhesive Layer;Journal of The Electrochemical Society;2011

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