Novel global planarization technology for interlayer dielectrics using spin on glass film transfer and hot pressing

Author:

Machida K.

Publisher

American Vacuum Society

Subject

General Engineering

Cited by 20 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

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3. Planarization of Patterned Recording Media;IEEE Transactions on Magnetics;2010-03

4. Nanoimprint planarization of high aspect ratio nanostructures using inorganic and organic resist materials;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2009

5. Wafer level packaging of MEMS;Journal of Micromechanics and Microengineering;2008-05-29

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