MEMS Process by Film Transfer Using a Fluorocarbon Anti-Adhesive Layer-Reference-Cited by-同舟云学术

MEMS Process by Film Transfer Using a Fluorocarbon Anti-Adhesive Layer

Published:2011 Issue:5 Volume:158 Page:H545
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Schelcher G.,Brault S.,Parrain F.,Lefeuvre E.,Dufour-Gergam E.,Tatoulian M.,Bouville D.,Desgeorges M.,Verjus F.,Bosseboeuf A.

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference37 articles.

1. Cantilever Fabrication by Force-Free Release Transfer

2. Adhesive wafer bonding

3. Temperature-controlled transfer and self-wiring for multi-color light-emitting diode arrays

4. Transfer printing by kinetic control of adhesion to an elastomeric stamp

5. Arrays of monocrystalline silicon micromirrors fabricated using CMOS compatible transfer bonding

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