Reduction of Large Particles in Ceria Slurry by Aging and Selective Sedimentation and its Effect on Shallow Trench Isolation Chemical Mechanical Planarization-Reference-Cited by-同舟云学术

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Reduction of Large Particles in Ceria Slurry by Aging and Selective Sedimentation and its Effect on Shallow Trench Isolation Chemical Mechanical Planarization

Published:2006-09-07 Issue:9A Volume:45 Page:6790-6794
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Kim Dae-Hyeong,Kang Hyun-Goo,Kim Sang-Kyun,Paik Ungyu,Park Jea-Gun

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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3. Preparation and characterization of slurry for CMP;Advances in Chemical Mechanical Planarization (CMP);2022

4. Tribological, Thermal and Kinetic Characterization of SiO2 and Si3N4 Polishing for STI CMP on Blanket and Patterned Wafers;ECS Journal of Solid State Science and Technology;2020-05-04

5. Enhanced performance and mechanism of bromate removal in aqueous solution by ruthenium oxide modified biochar (RuO2/BC);Colloids and Surfaces A: Physicochemical and Engineering Aspects;2019-07

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