Applicability of TiN Adhesion Layer Formed by Nitridation of Sputtered Ti Film to Blanket CVD-W Contact Filling-Reference-Cited by-同舟云学术

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Applicability of TiN Adhesion Layer Formed by Nitridation of Sputtered Ti Film to Blanket CVD-W Contact Filling

Published:1993-05-15 Issue:Part 1, No. 5A Volume:32 Page:1929-1933
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Chen Shih-Chang,Sakamoto Akihiro,Tamura Hiroyuki,Yoshimaru Masaki,Ino Masayoshi

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Adsorption and reaction of NH3 on Ti/Si(1 0 0);Applied Surface Science;2001-03

2. Reaction of Ti with WSi2;Journal of Applied Physics;1997-12-15

3. High aspect ratio contacts: A review of the current tungsten plug process;Thin Solid Films;1997-07

4. AFM, XPS and XRD Studies of W Films Growth by Lpcvd Onto Tin Substrates;MRS Proceedings;1995

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