Thermal Stability Enhancement of Cu Interconnects by Employing a Self-aligned MgO Layer Obtained From a Cu(Mg) Alloy Film-Reference-Cited by-同舟云学术

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Thermal Stability Enhancement of Cu Interconnects by Employing a Self-aligned MgO Layer Obtained From a Cu(Mg) Alloy Film

Published:2001-04-15 Issue:Part 1, No. 4A Volume:40 Page:2408-2412
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Lee Wonhee,Cho Heunglyul,Cho Bumseok,Yang Hee-Jung,Kim Jiyoung,Kim Yong-Suk,Jung Woo-Gwang,Kwon Hoon,Lee Jinhyung,Reucroft P. J.,Lee Chongmu,Lee Eungu,Lee Jaegab

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Evaluation of Cu(Ti) and Cu(Zr) alloys in barrier-less Cu metallization;Materials Chemistry and Physics;2018-09

2. Controlled Epitaxial Growth of Body-Centered Cubic and Face-Centered Cubic Cu on MgO for Integration on Si;Crystal Growth & Design;2013-09-25

3. Penetration of Copper-Manganese Self-Forming Barrier into SiO2Pore-Sealed SiCOH during Deposition;ECS Journal of Solid State Science and Technology;2013

4. Self-Forming Barriers;Metal-Dielectric Interfaces in Gigascale Electronics;2011-11-29

5. Interfacial phase formation in Cu–Mg alloy films on SiO2;Journal of Applied Physics;2004-03-15

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