Conformal Deposition and Gap-Filling of Copper into Ultranarrow Patterns by Supercritical Fluid Deposition
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,General Engineering
Link
http://stacks.iop.org/1882-0786/1/i=9/a=097002/pdf
Reference8 articles.
1. Deposition of Conformal Copper and Nickel Films from Supercritical Carbon Dioxide
2. Characteristics of copper deposition in a supercritical CO2 fluid
3. In situObservation of Initial Nucleation and Growth Processes in Supercritical Fluid Deposition of Copper
4. Precursor Evaluation for Cu-Supercritical Fluid Deposition Based on Adhesion Properties and Surface Morphology
5. Cu Wettability and Diffusion Barrier Property of Ru Thin Film for Cu Metallization
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