Characterization of Cleaning Technology for Silicon Surfaces by Hot Pure Water Containing Little Dissolved Oxygen-Reference-Cited by-同舟云学术

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Characterization of Cleaning Technology for Silicon Surfaces by Hot Pure Water Containing Little Dissolved Oxygen

Published:1996-08-15 Issue:Part 1, No. 8 Volume:35 Page:4577-4584
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Hayami Yuka,Suzuki Miki T.,Okui Yoshiko,Ogawa Hiroki,Fujimura Shuzo

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Adsorption of poly(oxyethylene) and hydroxyl group-containing nonionic surfactants on silica particles in NH4OH solution and its effect on the interaction force with Si surface;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2023-10

2. The Impact of Microroughness on the Generation of Watermarks on Etched Silicon Surfaces;Japanese Journal of Applied Physics;2007-01-10

3. Room temperature photo-oxidation of NH4F-prepared H–Si(111)(1×1) and Hx–Si(100);Journal of Applied Physics;2004-12

4. Development of clean technology in wafer drying processes;Journal of Cleaner Production;2001-06

5. Surface Cleaning and Carbonaceous Film Removal Using High Pressure, High Temperature Water, and Water/ CO 2 Mixtures;Journal of The Electrochemical Society;1998-01-01

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