Author:
Herman Irving P.,Donnelly Vincent M.,Cheng C.-C.,Guinn Keith V.
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Cited by
13 articles.
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1. Model analysis of the feature profile evolution during Si etching in HBr-containing plasmas;Journal of Vacuum Science & Technology A;2021-07
2. Atomic Layer Etching: Rethinking the Art of Etch;The Journal of Physical Chemistry Letters;2018-08-10
3. MD simulations of low energy Clx+ ions interaction with ultrathin silicon layers for advanced etch processes;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2014-03
4. Atomic-scale silicon etching control using pulsed Cl2 plasma;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2013-01
5. Critical review: Plasma-surface reactions and the spinning wall method;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2011-01