New Three-Dimensional Wafer Bonding Technology Using the Adhesive Injection Method-Reference-Cited by-同舟云学术

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New Three-Dimensional Wafer Bonding Technology Using the Adhesive Injection Method

Published:1998-03-30 Issue:Part 1, No. 3B Volume:37 Page:1217-1221
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Matsumoto Takuji,Satoh Masakazu,Sakuma Katsuyuki,Kurino Hiroyuki,Miyakawa Nobuaki,Itani Hikotaro,Koyanagi Mitsumasa

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Cited by 46 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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