Room-Temperature Cu–Cu Bonding in Ambient Air Achieved by Using Cone Bump
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,General Engineering
Link
http://stacks.iop.org/1882-0786/4/i=1/a=016501/pdf
Reference12 articles.
1. Fabrication of Back-Side Illuminated Complementary Metal Oxide Semiconductor Image Sensor Using Compliant Bump
2. Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs
3. Future system-on-silicon LSI chips
4. Microstructure examination of copper wafer bonding
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