Filling of Sub-µmThrough-holes by Self-sputter Deposition-Reference-Cited by-同舟云学术

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Filling of Sub-µmThrough-holes by Self-sputter Deposition

Published:1994-08-15 Issue:Part 1, No. 8 Volume:33 Page:4566-4569
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Asamaki Tatsuo,Miura Tsutomu,Takagi Akira,Mori Ryuji,Hirata Kazuo

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Cu filling into trenches with Co (00.2) layer by using high-vacuum magnetron sputtering in N2-addded Ar gas;Applied Surface Science;2015-11

2. Cu filling of 10 nm trenches by high-magnetic-field magnetron sputtering;Japanese Journal of Applied Physics;2014-04-16

3. Performance of Integrated Cu Gap-Filling Process with Chemical Vapor Deposition Cobalt Liner;Japanese Journal of Applied Physics;2013-05-01

4. Copper filling of deep sub-μm through-holes by high-vacuum planar magnetron sputtering using argon gas with added oxygen;Applied Surface Science;2009-11

5. Pulsed dc self-sustained magnetron sputtering;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2008-09

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