Copper filling of deep sub-μm through-holes by high-vacuum planar magnetron sputtering using argon gas with added oxygen-Reference-Cited by-同舟云学术

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Copper filling of deep sub-μm through-holes by high-vacuum planar magnetron sputtering using argon gas with added oxygen

Published:2009-11 Issue:4 Volume:256 Page:1240-1243
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Uhara Yoshio,Urano Tsubasa,Itoh Masatoshi,Hayashi Hideo,Manba Yousuke,Taniseki Akifumi,Jyan Houin,Nishikawa Eiichi,Saito Sigeru

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference13 articles.

1. Filling of Sub-µmThrough-holes by Self-sputter Deposition

2. Conf. Proc. ULSI-XI;Sano,1996

3. Directional copper deposition using dc magnetron self-sputtering

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Cu filling of 10 nm trenches by high-magnetic-field magnetron sputtering;Japanese Journal of Applied Physics;2014-04-16

2. Embedding of Copper into 30-nm-wide trench by a high-magnetic-field magnetron sputtering method with oxygen added sputtering gas;Journal of Physics: Conference Series;2013-03-01

3. Copper Filling of Deep Submicrometer Trenches with Ruthenium-Lined Barrier Metal by High-Vacuum Magnetron Sputtering Using Argon Gas with Added Oxygen;Japanese Journal of Applied Physics;2012-02-01

4. Copper Filling of Deep Submicrometer Trenches with Ruthenium-Lined Barrier Metal by High-Vacuum Magnetron Sputtering Using Argon Gas with Added Oxygen;Japanese Journal of Applied Physics;2012-01-13

5. Cu Filling of Deep-sub-^|^mu;m Trenches by High-Vacuum Sputtering Using Co Barrier Layer;Journal of the Vacuum Society of Japan;2012

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