1. 1) S. Shingubara, N. Awaya, K. Ueno and N. Misawa: Cu-Interconnect Technology (Realize Inc., Tokyo, 1998) p. 80.
2. 2) T. Asamaki, T. Kato, S. Saito, T. Kasukawa, H. Geka and K. Motohashi: Electrochemistry, 69 (2001) 769 〔in Japanese〕.
3. 3) Y. Uhara, T. Urano, M. Itoh, H. Hayashi, Y. Manba, A. Taniseki, H. Jyan, E. Nishikawa and S. Saito: Appl. Surf. Sci., 256 (2009) 1240.
4. 4) M. Itoh, T. Urano, Y. Uhara and S. Saito: Proc. 10th Int. Symp. on Sputtering and Plasma Processes (Kanazawa, Japan, 2009) p. 483.
5. 5) M. Itoh and S. Saito: Proc. 11th Int. Symp. on Sputtering and Plasma Processes (Kyoto, Japan, 2011) p. 524.