Parametric Study on the Physical Action of Steam–Water Mixture Jet: Removal of Photoresist Film from Silicon Wafer Surfaces-Reference-Cited by-同舟云学术

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Parametric Study on the Physical Action of Steam–Water Mixture Jet: Removal of Photoresist Film from Silicon Wafer Surfaces

Published:2012-05-16 Issue: Volume:51 Page:067101
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Mashiko Takashi,Sanada Toshiyuki,Nishiyama Itsuo,Horibe Hideo

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Three-dimensional Numerical Simulation of Liquid Film Formation and the Distribution of Cleaning Solutions on a Rotating Disk;Journal of Photopolymer Science and Technology;2022-12-16

2. Growth of α-Cr2O3 single crystals by mist CVD using ammonium dichromate;Applied Physics Express;2018-10-15

3. Band alignment at β-(AlxGa1−x)2O3/β-Ga2O3 (100) interface fabricated by pulsed-laser deposition;Applied Physics Letters;2018-06-04

4. Comparison of surface structures of corundum Cr2O3(0 0 0 1) and V2O3(0 0 0 1) ultrathin films by x-ray photoelectron diffraction;Journal of Physics: Condensed Matter;2018-01-23

5. Critical Review—Photocurrent Spectroscopy in Corrosion and Passivity Studies: A Critical Assessment of the Use of Band Gap Value to Estimate the Oxide Film Composition;Journal of The Electrochemical Society;2017

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