Analysis of Buried-Oxide Dielectric Breakdown Mechanism in Low-Dose Separation by Implanted Oxygen (SIMOX) Substrates Fabricated by Internal Thermal Oxidation (ITOX) Process

Author:

Kawamura Keisuke,Yano Takayuki,Hamaguchi Isao,Takayama Seiji,Nagatake Youichi,Matsumura Atsuki

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Characterization and analysis of silicon on insulator fabricated by separation by implanted oxygen layer transfer;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2010-01

2. Investigation on Silicon on Insulator Fabricated by Separation by Implanted Oxygen Layer Transfer;Journal of The Electrochemical Society;2010

3. Fabrication of thin-film silicon on insulator by separation by implanted oxygen layer transfer;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2008-11

4. Fabrication of silicon-on-insulator wafer by SIMOX layer transfer;2008 IEEE International SOI Conference;2008-10

5. Influence of Oxygen Partial Pressure on Thickness Change of Buried Oxide in Silicon-on-Insulator Structure during High-Temperature Oxidation Processes;Journal of The Electrochemical Society;2006

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