Development of Original End Point Detection System Utilizing Eddy Current Variation Due to Skin Effect in Chemical Mechanical Polishing
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Reference2 articles.
1. Defectless Monolithic Low-k/Cu Interconnects Produced by Chemically Controlled Chemical Mechanical Polishing Process withIn situEnd-Point-Detection Technique
2. Effect of temperature on copper damascene chemical mechanical polishing process
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