Future of Lead-Free Soldering
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Publisher
CRC Press
Link
http://www.crcnetbase.com/doi/pdf/10.1201/9780203025772.ch11
Reference3 articles.
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2. M Yamashita, K Suganuma, M Komagata, Y Shirai. An improvement of conductive adhesives on high temperature endurance by using Ag-Sn alloy powder. First International IEEE Conference on Polymers and Adhesives in Electronics and Photonics (Polytronic 2001), Potsdam, 2001, pp265-270.
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