Permanent Wafer Bonding and Temporary Wafer Bonding / De-Bonding Technology Using Temperature Resistant Polymers-Reference-Cited by-同舟云学术

Permanent Wafer Bonding and Temporary Wafer Bonding / De-Bonding Technology Using Temperature Resistant Polymers

Published:2014 Issue:2 Volume:27 Page:173-176
ISSN:0914-9244
Container-title:Journal of Photopolymer Science and Technology
language:en
Short-container-title:J. Photopol. Sci. Technol.

Author:

Ishida Hiroyuki,Lutter Stefan

Publisher

Technical Association of Photopolymers, Japan

Subject

Materials Chemistry,Organic Chemistry,Polymers and Plastics

Link

https://www.jstage.jst.go.jp/article/photopolymer/27/2/27_173/_pdf

Reference12 articles.

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3. 3. H. Ishida, S. Sood, C. Rosenthal, S. Lutter, 2nd IEEE CPMT Symposium Japan 2012, 10-12 Dec. 2012, Kyoto, Japan (2012) 1.

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