Subject
Polymers and Plastics,General Chemical Engineering,Biomaterials
Reference35 articles.
1. Characterization methods for ultrathin wafer and die quality: a review;Marks;IEEE Trans Compon Packag Manuf Technol,2014
2. Temporary bonding/debonding for ultrathin substrates;Pargfrieder;Solid State Technol,2008
3. Ultrathin-wafer processing utilizing temporary bonding and debonding technology;Matthias,2007
4. Permanent wafer bonding and temporary wafer bonding/de-bonding technology using temperature resistant polymers;Ishida;J Photopolym Sci Technol,2014
5. Temporary bonding and debonding study with the newly developed room temperature mechanical debonding material;Masuda;J Photopolym Sci Technol,2019
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