A Highly Compatible and Step-by-step Temporary Bonding and Debonding Strategy for Ultra-thin Wafer Level Package-Reference-Cited by-同舟云学术

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A Highly Compatible and Step-by-step Temporary Bonding and Debonding Strategy for Ultra-thin Wafer Level Package

Published:2023-07-31 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)
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Author:

Yao Mengqi¹,Hao Xin¹,Luo Guoling¹,Deng Jie¹,Wang Guosheng¹,Wang Jiang¹,Dai Qian¹,Chen Jian¹,Ke Zungui¹,Gong Chikun¹

Affiliation:

1. Southwest Institute of Technical Physics,Chengdu,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10305274/10305299/10305341.pdf?arnumber=10305341

Reference15 articles.

1. Study of a silicon/glass bonded structure with a UV-curable adhesive for temporary bonding applications

2. Permanent Wafer Bonding and Temporary Wafer Bonding / De-Bonding Technology Using Temperature Resistant Polymers

3. Chemical mechanical planarization for microelectronics applications

4. Temporary Bonding and debonding in advanced packaging: recent progress and applications;liu;Electronics,1666

5. Temporary bond-debond process for manufacture of flexible electronics: Impact of adhesive and carrier properties on performance

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