Electrical Via Chain Yield for DSA Contact Hole Shrink Process-Reference-Cited by-同舟云学术

Electrical Via Chain Yield for DSA Contact Hole Shrink Process

Published:2013 Issue:1 Volume:26 Page:21-26
ISSN:0914-9244
Container-title:Journal of Photopolymer Science and Technology
language:en
Short-container-title:J. Photopol. Sci. Technol.

Author:

Kato Hirokazu,Seino Yuriko,Yonemitsu Hiroki,Sato Hironobu,Kanno Masahiro,Kobayashi Katsutoshi,Kawanishi Ayako,Imamura Tsubasa,Omura Mitsuhiro,Nakamura Naofumi,Azuma Tsukasa

Publisher

Technical Association of Photopolymers, Japan

Subject

Materials Chemistry,Organic Chemistry,Polymers and Plastics

Link

https://www.jstage.jst.go.jp/article/photopolymer/26/1/26_21/_pdf

Reference6 articles.

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3. 3. H. Kato, Y. Seino, H. Yonemitsu, H. Sato, M. Kanno, K. Kobayashi, A. Kawanishi, T. Imamura, M. Omura, N. Nakamura and T. Azuma, Microelectronic Engineering (2013), in press.

4. 4. Y. Seino, H. Yonemitsu, H. Sato, M. Kanno, H. Kato, K. Kobayashi, A. Kawanishi, T. Azuma, M. Muramatsu, S. Nagahara, T. Kitano and T. Toshima, Proc. SPIE, Vol. 8323 (2012).

5. 5. B. Rathsack, M. Somervell, M. Muramatsu, K. Tanouchi, T. Kitano, E. Nishimura, K. Yatsuda, S. Nagahara, H. Iwaki, K. Akai, M. Ozawa, A. R. Negreira, S. Tahara and K. Nafus, Proc. SPIE, Vol. 8682 (2013)

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