Next Generation Photosensitive Dielectric Materials for Advanced Packaging Applications
Author:
Affiliation:
1. Technology Development Center, Hitachi Chemical DuPont MicroSystems, Ltd.
Publisher
Technical Association of Photopolymers, Japan
Subject
Materials Chemistry,Organic Chemistry,Polymers and Plastics
Link
https://www.jstage.jst.go.jp/article/photopolymer/31/4/31_451/_pdf
Reference21 articles.
1. 1. H. Makabe, T. Banba, and T. Hirano, J. Photopolym. Sci. Technol., 10 (1997) 307.
2. 2. M. Tomikawa, M. Suwa, S. Yoshida, Y. Fujita, R. Okuda, and G. Ohbayashi, J. Photopolym. Sci. Technol., 13 (2000) 357.
3. 3. K. Yamamoto and T. Hirano, J. Photopolym. Sci. Technol., 15 (2002) 173.
4. 4. R. Rubner, J. Photopolym. Sci. Technol., 17 (2004) 685.
5. 5. N. Anzai, M. Fujita, and A. Fujii, Proc. 64th ECTC, (2014) 829.
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