Affiliation:
1. Huawei Technologies Japan K.K.
Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Reference33 articles.
1. 1) D. Frye, R. Guino, S. Gupta, M. Sano, K. Sato, and K. Iida: "Gold-Gold Interconnects to Copper Pillar Using Fast Thermal Compression Bonding Using Non-Conductive Paste," Proceedings 60th Electronic Components and Technology Conference, pp. 427–430, 2010
2. 2) T. Nonaka, K. Fujimaru, N. Asahi, K. Kasumi, and Y. Matsumoto: "Development of wafer level NCF (non conductive film)," Proceedings 58th Electronic Components and Technology Conference, pp. 1550–1555, 2008
3. 3) T. Nonaka, Y. Kobayashi, N. Asahi, S. Niizeki, K. Fujimaru, Y. Arai, T. Takegami, Y. Miyamoto, M. Nimura, and H. Niwa: "High throughput thermal compression NCF bonding," Proceedings 64th Electronic Components and Technology Conference, pp. 913–918, 2014
4. 4) O. Suzuki, T. Enomoto, and K. Kotaka: "Design of Underfill Materials for the Latest Package," 2018 International Symposium on Semiconductor Manufacturing, FM-O-34, 2018
5. 5) C. Rudolph, A. Hanisch, M. Voigtländer, P. Gansauer, H. Wachsmuth, S. Kuttler, O. Wittler, T. Werner, I. Panchenko, and M. J. Wolf: "Enabling D2 W/D2D Hybrid Bonding on manufacturing equipment based on simulated process parameters," Proceedings of 71st Electronic Components and Technology Conference, pp. 40–44, 2021